Divisor 2/3/4/8 Vías 1GHz Digital Solder Back TCC

Features

• SMT technology for superior stability and reliability.
• Tin plated zinc alloy die cast housing with aluminum lid for corrosion protection.
• PRESS-IN sealing technology provides RFI shielding >130dB, with epoxy glue and water proof meet IP67 Standard (15psi).
• Extra blocking capacitor for DC/Hum protection.
• Low inter-modulation >105dB.
• High isolation in the return path.
• Nickel plated Zinc-alloy die-cast compact housing for corrosion protection.
• Back lid is glued and with PRESS-IN sealing technology provides RFI > 100dB.
• All F ports conform to ANSI/SCTE 02 2006 Standard with 360° type inner conductors seizure to ensure better holding force and transmission quality.
• Compliant with ANSI/SCTE 153 2008 Standard and CE.