(011) 4296-2442 / 4290-4424
/
info@inner.com.ar
Navegacion
Inicio
Nosotros
Servicios
Contactenos
Divisor 2/3/4/8 Vías 1GHz Digital Solder Back TCC
Home
Instalación Domiciliaria
Divisores
Divisor 2/3/4/8 Vías 1GHz Digital Solder Back TCC
Divisor 2/3/4/8 Vías 1GHz Digital Solder Back TCC
Category:
Divisores
Descripción
Features
SMT technology for superior stability and reliability.
Tin plated zinc alloy die cast housing with aluminum lid for corrosion protection.
PRESS-IN sealing technology provides RFI shielding >130dB, with epoxy glue and water proof meet IP67 Standard (15psi).
Extra blocking capacitor for DC/Hum protection.
Low inter-modulation >105dB.
High isolation in the return path.
Nickel plated Zinc-alloy die-cast compact housing for corrosion protection.
Back lid is glued and with PRESS-IN sealing technology provides RFI > 100dB.
All F ports conform to ANSI/SCTE 02 2006 Standard with 360° type inner conductors seizure to ensure better holding force and transmission quality.
Compliant with ANSI/SCTE 153 2008 Standard and CE.
Related products
Detalles
Mini Tap 1GHz Solder Back TCC – Modelo IDCG
Detalles
Divisor TV / DATA Con Filtro Banda De Retorno
Detalles
Divisor 2/3/4 Vías 1GHz Solder Back HOLLAND
WhatsApp